Applicable Material：sapphire, quartz crystals, optical glass, special ceramics, artificial gemstone, and other hard and valuable materials.
Max Processing Size:400*250*400mm×2（Double Worktable)
Cut Shape: Straight shape
Max Wire Speed: 1000m/min
The model was changed due to appearance and technology upgrade.
Product Introduction
This series is mainly used for high-precision and high-speed cutting of super hard and brittle materials, such as sapphire, optical glass, artificial gemstone, special ceramics, quartz crystal, electrode material, mono/polycrystalline silicon, aluminum oxide, aluminum nitride, magnetic materials, etc.
Features
2 workbenches make high production&efficiency.
Swing slicing makes stronger cutting force.
More selection for thick slices, it can achieve final slice thickness is 5mm~50mm.
Wire break memory system.
HMI is easy to operate.
Underside workbench, the workbench is upward movement.
Much stable, the whole-casted frame makes running stably.
Cutting sample
Parameter
| Item | Detail | Parameter |
| Model | Model | CA4040 |
| Ability | Maximum work size L*W*H | 400mm*250mm*400mm×2 |
| Thickness of slice | 5mm~60mm | |
| Workbench | Travel of worktable | Max422mm |
| Number of Worktable | 2 | |
| Roller | Outer Diameter* Workable width | φ180mm±10*260mmX5 rollers |
| Component | Resin(PE or PU) | |
| Diamond Wire | Wire diameter | φ0.20mm-φ0.37mm |
| Storage | Max40Km（φ0.25mm） | |
| Running speed | 1000m/min | |
| Lift speed | 0.1-99.9mm/min | |
| Fast feed speed | 300mm/min | |
| Power | Power | Three-phase 380V 50Hz |
| Size & Weight | Size L*W*H | 3000mm×2200mm×2820mm |
| Weight | 5000Kg |
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