Applicable Material: sapphire, magnetic material, specialceramics, artificial gemstone, electrode materialMono/polycrystalline silicon, aluminum oxide(Al203),aluminum nitride(AlN), rare metals and alloys, and other hardand valuable materials
Max Processing Size:800x800x800mm
Cut Shape: Straight shape
Max Wire Speed: 1500m/min
The model was changed due to appearance and technologyupgrade.
Product Introduction
This series is mainly used for high-precision and high-speed cutting of super hard and brittle materials, such as sapphire, optical glass, artificial gemstone, special ceramics, quartz crystal, electrode material, mono/polycrystalline silicon, aluminum oxide, aluminum nitride, magnetic materials, etc.
Features
Swing slicing makes stronger cutting force.
Good choice for large size cutting material.
Quieter, the noise less than 80db.
High-speed, the fastest wire speed can be achieved at 1500m/min.
Wire break memory system.
HMI is easy to operate.
Much stable, the whole-casted frame makes running stably.
Cutting sample
Parameter
| Item | Detail | Parameter |
| Model | Model | DCX800 |
| Running Mode | Running Mode | Reciprocating running |
| Diamond | Storage | 40Km |
| Running Speed | Max1200m/min | |
| Wire diamond | φ0.25mm~φ0.6mm | |
| Workbench | Workbench swing angle | ±30° |
| Maximum work size | 800mm*800mm*800mm | |
| Number of workbench | 1 | |
| Noise | Noise | ≤80db |
| Power | Power | Three-phase 380V 50Hz |
| Full-load Power | 15kw | |
| Air supply | 0.35Mpa-600L/min | |
| Size & Weight | Size L*W*H | 2510mm*2700mm*2500mm |
| Weight | 5000Kg |
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