-Defined cutting of round and rectangular Sapphire/Quartz Crystal/Optics cores of different sizes and shapes.
-Accuracy 0.01mm (all axes).
-No thermal influences on the workpiece material during the cutting process.
-Cutting speed/ feed speed freely selectable according to customer’s requirements.
-CE Conformity.
- Bow: Smaller
- Warp: Smaller
- Good parallelism
- Total thickness tolerance: Smaller
- Low cutting loss between slices
- The surface damage layer of the processed wafer is shallow and the roughness is smaller
- High efficiency
- High productivity
- High return on investment
