2005
SET UP
Set up business with Quartz Crystal SMD Flattening Machine and 49S Spot Welding Packaging Machine.
Yantai Likai Numerical Control Technology Co., Ltd. was established in 2008, covering an area of over 25,300 square meters. LiKai is a high-tech innovative enterprise integrating R & D, manufacturing, sales and service. The company’s leading product, multi-wire cutting machine, is mainly used for precision cutting of Magnetic Materials, Sapphire, Semiconductor Materials, Optical Glass, Quartz Crystals, Ceramic, Artificial Gemstone, Electrode Material, Alloys and other hard and brittle materials.We are committed to deep cultivation and continuous innovation in the filed of multi-wire cutting equipment, and keep exploring and practicing in emerging fileds such as laser cutting equipments, intelligent automatic management system and customized equipments. Our products have been widely used in the filed of automotive, consumer electronics, aerospace, aviation and military. Our company mainly manufacture high-end intelligent multi-wire cutting machines, and won the title of National Specialized and sophisticated “little giant” firm.
SET UP
Set up business with Quartz Crystal SMD Flattening Machine and 49S Spot Welding Packaging Machine.
STRATEGY TRANSITION
Enter the field of multi-wire cutting.
Research and develop the first oil slurry multi-wire saw CG450.
Successfully develop CF400T, realize diamond wire cutting instead of oil slurry cutting.
BUILD UP THE STATUS
CX2121, the first double-worktable multi-wire saw in the industry.
CR600，the first double-worktable multi-wire saw for cutting arc shape in the industry.
RAPIDLY DEVELOP
CX680，double-worktable multi-wire saw.
DA300，new breakthrough in the semiconductor field, the highest wire speed is up to 2400m/min.
HIT A RECORD HIGH
CX3615，double-worktable multi-wire saw for Magnetics straight sheet cutting.
DCX1000，single-wire saw for large materials, the maximum cutting range can be 1000x1000mm.
INDUSTRY EXPAND
Increase diamond wire production lines.
High hardness, high efficiency, low loss.
Provide one-stop solution to equipment consumables supply problems.
INTEGRATLY DEVELOP
Continuously devop in cutting technology field.
Create a whole industry chain development ecosystem of cutting machine, consumables and services.
Provide customers with more superior and comprehensive services.
Enable Likai to develop a new pattern.
Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
The maximum diameter of the cut material is up to 1000mm.
The minimum thickness of the wafers after cutting is 0.1mm.
±10μm. It’s subject to the cut material, please consult us for actual data.
The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.
Copyright © 2023 LiKai
